Advanced Micro Devices, Inc Recruitment September 2026 - Advanced Micro Devices, Inc calls the applicant to fill Jawatan Kosong SMTS Packaging Engineer, that will be placed in Bayan Lepas. You will definitely get a better prospect as well as less dangerous life sometime soon. Becoming a member of this company makes a people can attain the goal easier and create the aim come true.

To help this business vision and mission happens on right Advanced Micro Devices, Inc will be wide open of fresh placement seeing that Oktober 2024. Everybody who are enthusiastic filling this particular vacant, please take a part in this Jawatan Kosong SMTS Packaging Engineer recruitment. If you are one that may load requirements, you can attempt to learn more info about Jawatan Kosong SMTS Packaging Engineer below.

Advanced Micro Devices, Inc Job Vacancies September 2026

Jawatan Kosong SMTS Packaging Engineer in Bayan Lepas Overview: WHAT YOU DO AT AMD CHANGES EVERYTHING We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. AMD together we advance_ Responsibilities: THE ROLE: Main role is to lead assembly technology development with OSAT and foundry partners. In parallel this individual is also expected to drive technology development across the industry to meet future requirements.
THE PERSON: This individual should be self-motivated and is able to work independently with minimal supervision. Excellent communication skills to collaborate with both internal and external partners. Established relationship with industry partners in the field of advanced assembly technology specifically in large module on substrate assembly.
KEY RESPONSIBILITIES:

• Drive OSAT to develop advance assembly technology capabilities to meet technology development deliverables.
• Collaborate with integration and design teams to integrate assembly and design needs. Formulate plans to enhance assembly capabilities to meet design needs.
• Establish ecosystem partners to identify assembly capability improvement roadmap

PREFERRED EXPERIENCE:

• In depth process knowledge of key assembly processes: die prep, various die bond methods, underfill, lid attach etc..
• Hands-on experience on large module/die assembly challenges, chip on wafer/panel and chip on substrate experience.
• Well verse in typical technology development tools, FMEA, SPC, control plans, etc..
• Ability to communicate well in both English and Chinese language

ACADEMIC CREDENTIALS:

• MS degree in Mechanical or Material or Chemical Engineering.

LOCATION:

Penang, Malaysia

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Qualifications: Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

As one of the leading companies in Malaysia, Advanced Micro Devices, Inc offers variety of opportunities for employees to grow and make them as future leaders of the professional and disciplined. Advanced Micro Devices, Inc also offers a dynamic work environment in order to encourage employees to give optimally, and at the same time, you are able to work up new skills and erudition through the company programs.

If You are interested to send an application for Jawatan Kosong SMTS Packaging Engineer Bayan Lepas Oktober 2024 by Advanced Micro Devices, Inc, please prepare requirements files and documents as soon as possible. To apply by online, please click the "Apply" button below. If you still do not satisfy with a hiring job above, you can try to read more jobs list in Bayan Lepas region from another company below.

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