Hewlett Packard Recruitment Mei 2025 - Hewlett Packard give away an opportunity to fill Jawatan Kosong MEMS Product Engineer, that will be placed in Simpang Ampat. You will definitely get a better prospect as well as safer dwell in the future. Signing up for this company makes a people able to carry out the aim simpler in supplementary to assist the current dream be realized.

To help the corporation eyesight and mission happens on correct Hewlett Packard is usually open of fresh placement as Julai 2024. Everyone who are enthusiastic about staffing this particular vacant, remember to engage in this Jawatan Kosong MEMS Product Engineer recruitment. If you are one that may load requirements, you can try to see more information about Jawatan Kosong MEMS Product Engineer below.

Hewlett Packard Job Vacancies Mei 2025

The MEMS product engineer will be leading, working closely with manufacturing engineers to ensure that quality MEMS printhead are manufactured to support the manufacturing of the Print cartridge. He/she has a good understanding of all the processes in the respective work centers that manufactured the Printhead. He/she has a deep understanding of the processes that relate to the product functionality and performance.

He/she will be leading qualifications for changes in materials, processes to ensure that we continue to be product high quality product with all these changes. He/she will design test plan, design of experiment to test and understand the margins of the product. He/she will work closely with the test center to test, characterize the reliability and performance of the product. He/she will be using data to make proposal, recommendation and decision on risk call.

He/she will be performing value engineering to improve product performance and quality. He/she will partner with his/her counterparts to introduce industrial 4.0 to drive faster time to detect at all work center. He/she will be working with the partners in driving time to contain, time to resolution on issues and escalation.

What does the MEMS Product engineer do:

• Lead team in ensuring manufacturing of quality Printhead for the production of Print cartridge
• Lead and collaborate with partners to qualify new materials, process changes, characterization, and reliability testing.
• Lead the team in the investigation of products & processes to drive root-cause.
• Lead the team to effectively communicate analysis findings and insights across functions and levels in the organization.
• Lead the team to develop new analysis and testing capabilities to improve product understanding and know-how.
• Lead the team to drive product and manufacturing process improvement
• Lead the team in application of Industry 4.0 elements to drive quality, productivity and efficiency.
• People engagement to develop and build a high performing team.
• Ensure all compliance requirement are meet for EHS and quality.

Individuals who do well in this role at HP, usually possess:

• Bachelor’s, Master’s degree or PhD in Electrical/Electronics, Chemistry, Material Science, Chemical Engineering or relevant.
• Strong people managing and collaboration skills with the ability to lead diverse team
• Strong analytical, problem solving, decision-making skills.
• Strong communication skills - able to present findings to internal stakeholders.
• Lead the team and able to collaborate across geographies, levels, and functions.
• Good understanding of TIJ technologies and common failure modes, able to perform autopsy and sample preparations.
• Good understand of design of experiment, design of test plan, product reliability, characterization
• Good understanding of Industrial 4.0.
• Knowledge of ISO9K, ISO 14K/18K/ 45K/ 50K, Lean Sigma and chemical management will be advantageous.

As one of the leading companies in Malaysia, Hewlett Packard offers variety of opportunities for employees to grow and make them as future leaders of the professional and disciplined. Hewlett Packard also offers a dynamic work environment in order to encourage employees to give optimally, and at the same time, you are able to learn new experience and erudition through the company programs.

If You are interested to submit an application for Jawatan Kosong MEMS Product Engineer Simpang Ampat Julai 2024 by Hewlett Packard, please prepare requirements files and documents as soon as possible. To apply by online, please click the "Apply" button below. If you still do not satisfy with a job recruitment above, you can try to read more jobs list in Simpang Ampat region from another company below.

Related Jobs