Globetronics Sdn Bhd Hiring Oktober 2026 - Globetronics Sdn Bhd offer a chance to apply Jawatan Kosong Equipment & Process Engineer – Sawing & Mounter Condux/Takatori, that will be placed in Bayan Lepas. You will receive a better potential customer as well as safer dwell later on. Becoming a member of this company makes a person can meet the goal simpler in addition to assist the current dream be realized.

To help the organization eyesight and mission arrives on right Globetronics Sdn Bhd is usually started on fresh placement seeing that September 2026. All people who are considering about filling up this specific vacant, you need to take a part in this Jawatan Kosong Equipment & Process Engineer – Sawing & Mounter Condux/Takatori recruitment. If you are one that can certainly fill up requirements, you can look at more information about Jawatan Kosong Equipment & Process Engineer – Sawing & Mounter Condux/Takatori below.

Globetronics Sdn Bhd Job Vacancies Oktober 2026

Jawatan Kosong Equipment & Process Engineer – Sawing & Mounter Condux/Takatori in Bayan Lepas

Equipment & Process Engineer – Sawing & Mounter (Condux/Takatori)

Location: Bayan Lepas, Penang, Malaysia
Employment Type: Permanent | Full-Time

Job Summary

We are seeking an experienced Equipment & Process Engineer – Sawing & Mounter with hands-on experience in Condux/Takatori mounter and semiconductor sawing processes. The successful candidate will be responsible for process development, optimization, troubleshooting, equipment qualification, yield improvement, and continuous improvement to ensure stable and efficient semiconductor manufacturing operations.

Key Responsibilities

• Develop, optimize, and sustain semiconductor sawing and mounter processes.
• Support and optimize Condux/Takatori mounter equipment and related process parameters.
• Set up, qualify, and optimize sawing/mounting recipes for new and existing products.
• Troubleshoot process and equipment-related issues and implement corrective actions.
• Monitor and improve yield, quality, productivity, cycle time, and process capability.
• Analyze sawing and mounting defects such as die chipping, cracking, kerf variation, misalignment, die damage, and mounting issues.
• Conduct process qualification, validation, capability studies, and engineering evaluations.
• Support NPI, product transfer, engineering builds, and new equipment introduction.
• Work closely with Production, Equipment, QA, and NPI teams to resolve manufacturing issues.
• Develop and maintain process specifications, SOPs, work instructions, control plans, and process documentation.
• Apply SPC, DOE, PFMEA, RCA, 8D and CAPA for process improvement.
• Drive continuous improvement, cost reduction, cycle-time improvement, and process stability initiatives.
• Support preventive maintenance, equipment calibration, and equipment performance improvement.
• Ensure compliance with quality, safety, ESD, and semiconductor manufacturing requirements.

Requirements

• Bachelor’s Degree in Electrical, Electronics, Mechanical, Mechatronics, Manufacturing Engineering or related field.
• 2–5 years of experience in semiconductor, electronics, or precision manufacturing.
• Hands-on experience with semiconductor sawing/dicing processes.
• Experience with Condux and/or Takatori mounter equipment is highly preferred.
• Good understanding of wafer/die handling and mounting processes.
• Experience in process troubleshooting, optimization, qualification, and yield improvement.
• Knowledge of semiconductor backend manufacturing processes.
• Familiar with SPC, DOE, PFMEA, RCA, 8D and CAPA.
• Strong analytical, problem-solving, communication, and teamwork skills.
• Able to work independently and support production requirements in a fast-paced manufacturing environment.

Preferred Technical Skills / Keywords

Condux Mounter | Takatori Mounter | Mounter | Sawing | Dicing | Wafer Sawing | Semiconductor Sawing | Wafer Mounting | Semiconductor Assembly | Process Engineering | Process Development | Process Optimization | Yield Improvement | NPI | Equipment Qualification | Recipe Optimization | Die Chipping | Die Cracking | Wafer Handling | SPC | DOE | PFMEA | RCA | 8D | CAPA

Added Advantage

Experience in any of the following will be an advantage:

• Wafer sawing / dicing
• Wafer mounting and tape mounting
• Die sorting / pick & place
• UV curing / tape expansion
• Vision alignment and inspection
• Blade selection and optimization
• Sawing parameter optimization
• Semiconductor backend assembly processes
• Equipment programming and troubleshooting
• Lean Manufacturing / Six Sigma

Job Type: Full-time

Pay: RM5,500.00 - RM7,000.00 per month

Benefits:

• Additional leave
• Dental insurance
• Flexible schedule
• Free parking
• Health insurance
• Maternity leave
• Opportunities for promotion
• Parental leave
• Professional development

Work Location: In person

As one of the leading companies in Malaysia, Globetronics Sdn Bhd opens variety of opportunities for employees to grow and make them as future leaders of the professional and disciplined. Globetronics Sdn Bhd also offers a dynamic work environment in order to encourage employees to give optimally, and at the same time, you are able to increase new experience and knowledge through the company programs.

If You are interested to submit an application for Jawatan Kosong Equipment & Process Engineer – Sawing & Mounter Condux/Takatori Bayan Lepas September 2026 by Globetronics Sdn Bhd, please prepare requirements files and documents as soon as possible. To apply by online, please click the "Apply" button below. If you still do not satisfy with a hiring job above, you can try to read more jobs list in Bayan Lepas region from another company below.

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